With newly developed core-mount technology, enlarged 58mm integrated driver units, tungsten coated diaphragm all encompassed behind a honeycomb punched design, this flagship headphone marks a culmination of the latest in audiophile listening.

Newly developed Core Mount Technology (PAT.P) for a wide range audio reproduction. Integrated driver unit design for maximum reduction of unwanted vibration. 58 mm driver unit integrated in baffle utilises a Permendur Magnetic Circuit and Tungsten coated diaphragm provides high rigidity for an improved transient response. New honeycomb punched housing design without side ventilation to avoid undesirable air pressure loss from inside.

Each housing is carefully hand assembled in Tokyo, Japan. The magnesium frame and arm results in a rigid, thin and lightweight construction. Each unit is individually identified by a laser etched serial number.